Provided is a semiconductor package. The semiconductor package may include a first redistribution structure, a first semiconductor chip including a first surface and a second surface, the first surface being disposed to face the first redistribution structure, a second redistribution structure disposed on the second surface of the first semiconductor chip and including a second insulating layer and a second redistribution layer, a first sealing layer disposed between the first and second redistribution structures and configured to cover the second surface of the first semiconductor chip, and a connection structure configured to connect the first and the second redistribution structures, wherein the second redistribution layer includes a first via and a second via on the first via, wherein the first via includes first and second seed layers, and a conductive layer on the second seed layer, and wherein the first sealing layer includes a photosensitive insulating material.