Invention Publication
- Patent Title: 3DSFET STANDARD CELL ARCHITECTURE WITH SOURCE-DRAIN JUNCTION ISOLATION
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Application No.: US17984042Application Date: 2022-11-09
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Publication No.: US20240047456A1Publication Date: 2024-02-08
- Inventor: Ming HE , Mehdi SAREMI , Rebecca PARK , Muhammed AHOSAN UL KARIM , Harsono SIMKA , Sungil PARK , Myungil KANG , Kyungho KIM , Doyoung CHOI , JaeHyun PARK
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/417 ; H01L29/06 ; H01L29/423 ; H01L29/78

Abstract:
Provided is a three-dimensionally stacked field-effect transistor (3DSFET) device which includes: a 1st lower source/drain region and a 2nd lower source/drain region connected to each other through a 1st lower channel structure controlled by a 1st gate structure; and a 1st upper source/drain region and a 2nd upper source/drain regions, respectively above the 1st lower source/drain region and the 2nd lower source/drain region, and connected to each other through a 1st upper channel structure controlled by the 1st gate structure, wherein the 2nd lower source/drain region and the 2nd upper source/drain region form a PN junction therebetween.
Information query
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