Invention Publication
- Patent Title: SEMICONDUCTOR WAFER TEST SYSTEM BY FEEDBACK CONTROL
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Application No.: US18232056Application Date: 2023-08-09
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Publication No.: US20240053399A1Publication Date: 2024-02-15
- Inventor: Gibong LEE , Sungok Yu
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20220100006 2022.08.10
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
A wafer test system includes: a first heat source unit including a first refrigerant having a first temperature range; a second heat source unit including a second refrigerant having a second temperature range; a wafer chuck to support a wafer, which: a heating member to heat the wafer, and a channel to circulate the first refrigerant and the second refrigerant; a first supply line connected to the first heat source unit, the first supply line to circulate and supply the first refrigerant to the channel; a second supply line connected to the second heat source unit, the second supply line to circulate and supply the second refrigerant to the channel; and a controller to selectively control supply of the first refrigerant and the second refrigerant based on a target temperature for testing the wafer on the wafer chuck.
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