Invention Publication
- Patent Title: INTERCONNECT MECHANISM FOR IMAGE CAPTURE DEVICE
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Application No.: US18231412Application Date: 2023-08-08
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Publication No.: US20240053660A1Publication Date: 2024-02-15
- Inventor: Bessy Wen-Han Liang , Nicholas D. Woodman , Nicholas Vitale , Huy Phuong Nguyen
- Applicant: GoPro, Inc.
- Applicant Address: US CA San Mateo
- Assignee: GoPro, Inc.
- Current Assignee: GoPro, Inc.
- Current Assignee Address: US CA San Mateo
- Main IPC: G03B17/04
- IPC: G03B17/04 ; G03B17/12 ; G03B17/55 ; G03B17/56

Abstract:
A camera housing includes a first surface and a second surface noncoplanar with the first surface. A first interconnect mechanism is coupled to the first surface and rotatable between a collapsed position and an extended position. In the collapsed position, protrusions of the first interconnect mechanism extend parallel to the first surface. In the extended position, the protrusions of the first interconnect mechanism extend in a perpendicular manner away from the first surface. A second interconnect mechanism is coupled to the second surface and rotatable between a collapsed position and an extended position. In the collapsed position, protrusions of the second interconnect mechanism include coplanar surfaces and extend adjacent to the second surface. In the extended position, the protrusions of the second interconnect mechanism extend in a perpendicular manner away from the second surface.
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