发明公开
- 专利标题： LED ARRAY PACKAGE
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申请号： US18453164申请日： 2023-08-21
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公开(公告)号： US20240063352A1公开(公告)日： 2024-02-22
- 发明人: Vladimir ODNOBLYUDOV , Scott West , Cem Basceri , Zhengqing Gan
- 申请人： Bridgelux, Inc.
- 申请人地址： US CA Fremont
- 专利权人： Bridgelux, Inc.
- 当前专利权人： Bridgelux, Inc.
- 当前专利权人地址： US CA Fremont
- 主分类号： H01L33/56
- IPC分类号： H01L33/56 ; H01L33/46
摘要：
Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.
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IPC分类:
