HIGH EFFICIENCY CHIP-ON-BOARD LIGHT-EMITTING DIODE

    公开(公告)号:US20220013506A1

    公开(公告)日:2022-01-13

    申请号:US17384264

    申请日:2021-07-23

    申请人: BRIDGELUX, inc.

    IPC分类号: H01L25/075

    摘要: An LED CoB structure with the combination use of blue and red LED dies is used to achieve warm white light, with good quantum conversion efficiency at a reasonably low cost. Both the red and blue LED dies are fabricated on transparent substrates. The current density of the LED dies is designed to match the different degradation rate of each type of LED die. The methods used to achieve high efficiency include adjusting the power, wavelength, and/or position of the dies.

    LIGHT-EMITTING DEVICE WITH REFLECTIVE CERAMIC SUBSTRATE

    公开(公告)号:US20210010656A1

    公开(公告)日:2021-01-14

    申请号:US16879498

    申请日:2020-05-20

    申请人: BRIDGELUX, INC.

    摘要: A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure.

    LED ARRAY PACKAGE
    4.
    发明公开
    LED ARRAY PACKAGE 审中-公开

    公开(公告)号:US20240097084A1

    公开(公告)日:2024-03-21

    申请号:US18525084

    申请日:2023-11-30

    申请人: Bridgelux, Inc.

    IPC分类号: H01L33/56 H01L33/46

    CPC分类号: H01L33/56 H01L33/46

    摘要: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.

    LED ARRAY PACKAGE
    5.
    发明公开
    LED ARRAY PACKAGE 审中-公开

    公开(公告)号:US20240063352A1

    公开(公告)日:2024-02-22

    申请号:US18453164

    申请日:2023-08-21

    申请人: Bridgelux, Inc.

    IPC分类号: H01L33/56 H01L33/46

    CPC分类号: H01L33/56 H01L33/46

    摘要: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.

    LINEAR LED MODULE
    6.
    发明申请

    公开(公告)号:US20220026034A1

    公开(公告)日:2022-01-27

    申请号:US17391849

    申请日:2021-08-02

    申请人: Bridgelux, Inc.

    摘要: Various aspects of a light emitting apparatus include a substrate having at least one angled portion. Some aspects of the light emitting apparatus include at least one light emitting device arranged on the substrate. Some aspects of the light emitting apparatus include a plurality of conductors arranged on the substrate. In some aspects of the light emitting apparatus, the conductors are electrically coupled to the at least one light emitting device.

    CHIP-ON-BOARD DESIGN WITH COLOR MIXING

    公开(公告)号:US20210151420A1

    公开(公告)日:2021-05-20

    申请号:US17074324

    申请日:2020-10-19

    申请人: BRIDGELUX, INC.

    IPC分类号: H01L25/075

    摘要: Some embodiments of the disclosure provide for a lighting system including a substrate. The lighting system includes several blue light emitting diodes (LEDs) supported by the substrate. The lighting system includes at least one red LED supported by the substrate. The lighting system includes a light conversion material covering the blue LEDs and the at least one red LED.

    CHIP-ON-BOARD DESIGN WITH COLOR MIXING
    8.
    发明申请

    公开(公告)号:US20200051960A1

    公开(公告)日:2020-02-13

    申请号:US16549147

    申请日:2019-08-23

    申请人: BRIDGELUX, INC.

    IPC分类号: H01L25/075

    摘要: Some embodiments of the disclosure provide for a lighting system including a substrate. The lighting system includes several blue light emitting diodes (LEDs) supported by the substrate. The lighting system includes at least one red LED supported by the substrate. The lighting system includes a light conversion material covering the blue LEDs and the at least one red LED.

    CHIP-ON-BOARD DESIGN WITH COLOR MIXING
    9.
    发明申请
    CHIP-ON-BOARD DESIGN WITH COLOR MIXING 审中-公开
    带彩色混合的板上设计

    公开(公告)号:US20160273749A1

    公开(公告)日:2016-09-22

    申请号:US15072304

    申请日:2016-03-16

    申请人: BRIDGELUX, INC.

    IPC分类号: F21V23/00

    摘要: Some embodiments of the disclosure provide for a lighting system including a substrate. The lighting system includes several blue light emitting diodes (LEDs) supported by the substrate. The lighting system includes at least one red LED supported by the substrate. The lighting system includes a light conversion material covering the blue LEDs and the at least one red LED.

    摘要翻译: 本公开的一些实施例提供了包括基板的照明系统。 照明系统包括由衬底支撑的几个蓝色发光二极管(LED)。 照明系统包括由衬底支撑的至少一个红色LED。 照明系统包括覆盖蓝色LED和至少一个红色LED的光转换材料。

    LINEAR LED MODULE
    10.
    发明申请
    LINEAR LED MODULE 有权
    线性LED模块

    公开(公告)号:US20160033105A1

    公开(公告)日:2016-02-04

    申请号:US14450111

    申请日:2014-08-01

    申请人: BRIDGELUX, INC.

    摘要: Various aspects of a light emitting apparatus include a substrate having at least one angled portion. Some aspects of the light emitting apparatus include at least one light emitting device arranged on the substrate. Some aspects of the light emitting apparatus include a plurality of conductors arranged on the substrate. In some aspects of the light emitting apparatus, the conductors are electrically coupled to the at least one light emitting device.

    摘要翻译: 发光装置的各个方面包括具有至少一个倾斜部分的基板。 发光装置的一些方面包括布置在基板上的至少一个发光器件。 发光装置的一些方面包括布置在基板上的多个导体。 在发光装置的一些方面,导体电耦合到至少一个发光装置。