Invention Publication
- Patent Title: RESIST COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
-
Application No.: US18127118Application Date: 2023-03-28
-
Publication No.: US20240069437A1Publication Date: 2024-02-29
- Inventor: Suk Koo HONG , Moo Hyun KOH , Kyungoh KIM , Jaemyoung KIM
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20220109409 2022.08.30
- Main IPC: G03F7/004
- IPC: G03F7/004 ; H01L21/027
Abstract:
A resist composition and a method of manufacturing a semiconductor device, the resist composition includes an organometallic compound, the organometallic compound including a central metal and ligands combined with the central metal; and an excess ligand compound, the excess ligand compound being combinable with the central metal via a coordination bond.
Information query
IPC分类:
