公开(公告)号：US20240231222A1

公开(公告)日：2024-07-11

申请号：US18212913

申请日：2023-06-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungoh KIM ,  Sunghyun HAN ,  SukKoo HONG ,  Moo Hyun KOH ,  Haeng Deog KOH ,  Yoonhyun KWAK ,  Jaemyoung KIM

IPC: G03F7/004 ,  C07F7/22 ,  H01L21/027

CPC classification number: G03F7/0042 ,  C07F7/2224 ,  H01L21/0275 ,  H01L21/0276

Abstract: Provided is a photoresist composition including an organometallic compound including: a central metal; a first ligand compound; and a second ligand compound, wherein the first ligand compound bonds with the central metal, the second ligand compound does not bond with the central metal, and the first or second ligand compound includes a halogen element. The photoresist composition may improve photosensitivity while securing stability.

公开(公告)号：US20240069437A1

公开(公告)日：2024-02-29

申请号：US18127118

申请日：2023-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Suk Koo HONG ,  Moo Hyun KOH ,  Kyungoh KIM ,  Jaemyoung KIM

IPC: G03F7/004 ,  H01L21/027

CPC classification number: G03F7/0042 ,  H01L21/0274

Abstract: A resist composition and a method of manufacturing a semiconductor device, the resist composition includes an organometallic compound, the organometallic compound including a central metal and ligands combined with the central metal; and an excess ligand compound, the excess ligand compound being combinable with the central metal via a coordination bond.

公开(公告)号：US20230176477A1

公开(公告)日：2023-06-08

申请号：US17841031

申请日：2022-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sukkoo HONG ,  Moohyun KOH ,  Kyungoh KIM ,  Yechan KIM ,  Kyunghwan NOH ,  Sungan DO ,  Hyun-Ji SONG

IPC: G03F7/004 ,  G03F7/38 ,  H01L21/027

CPC classification number: G03F7/0042 ,  G03F7/38 ,  H01L21/0274

Abstract: A photoresist composition includes an organometallic compound including at least one metal-ligand bond, the organometallic compound including a metal core and at least one organic ligand bonded to the metal core, and being configured such that the at least one metal-ligand bond is not breakable by exposure to light or moisture; a photoinitiator generating an acid or a radical in response to exposure to light; and a solvent.