Invention Publication
- Patent Title: MOISTURE-CURABLE SEMICONDUCTIVE FORMULATION
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Application No.: US18259862Application Date: 2022-03-23
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Publication No.: US20240071645A1Publication Date: 2024-02-29
- Inventor: Paul J. Caronia , Jeffrey M. Cogen , Bharat I. Chaudhary , Timothy J. Person , Suh Joon Han
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- International Application: PCT/US2022/021513 2022.03.23
- Date entered country: 2023-06-29
- Main IPC: H01B3/44
- IPC: H01B3/44 ; C08K3/04 ; C08L23/08 ; C09D123/08 ; H01B13/14

Abstract:
A moisture-curable semiconductive formulation consisting essentially of a mixture of an ethylene/(alkenyl-functional hydrolyzable silane)/(optional olefinic hydrocarbon) copolymer and a conventional carbon black. Also discovered methods of making and using same, a moisture-cured semiconductive product made therefrom, and articles containing or made from same.
Public/Granted literature
- US3220102A Method of forming sheet material Public/Granted day:1965-11-30
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