Invention Publication
- Patent Title: SOFT MAGNETIC ALLOY POWDER, MAGNETIC CORE, MAGNETIC COMPONENT, AND ELECTRONIC DEVICE
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Application No.: US18458597Application Date: 2023-08-30
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Publication No.: US20240071663A1Publication Date: 2024-02-29
- Inventor: Masakazu HOSONO , Kazuhiro YOSHIDOME , Akito HASEGAWA , Yoshiki KAJIURA
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP 22138395 2022.08.31
- Main IPC: H01F1/20
- IPC: H01F1/20 ; B22F1/052 ; B22F1/06 ; B22F1/142 ; B22F3/02 ; B22F3/24 ; B22F5/10 ; B22F9/00 ; B22F9/08 ; C22C33/04 ; C22C38/00 ; C22C38/02 ; C22C38/06 ; C22C38/08 ; C22C38/10 ; C22C38/12 ; C22C38/16 ; C22C38/30 ; C22C38/32 ; C22C38/34
Abstract:
A soft magnetic alloy powder comprises first particles to fifth particles, each having a particle size within a specific range. Among the first particles to the fifth particles, nth particles have an average particle size xn (μm), an average circularity yn, and a variance zn of circularity, where nth is any ordinal number from first to fifth. Points (xn, yn) (n=1 to 5) plotted in an xy plane define an approximate straight line having a slope “my” of −0.0030 or more. Points (xn, zn) (n=1 to 5) plotted in an xz plane define an approximate straight line having a slope “mz” of 0.00050 or less.
Information query
