Invention Publication
- Patent Title: CAVITY-LESS INTERCONNECT COMPONENT ON GLASS CORE
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Application No.: US17900692Application Date: 2022-08-31
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Publication No.: US20240071938A1Publication Date: 2024-02-29
- Inventor: Jeremy D. Ecton , Hiroki Tanaka , Brandon Christian Marin , Srinivas V. Pietambaram , Suddhasattwa Nad
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L23/00 ; H01L23/15 ; H01L23/498 ; H01L25/065
Abstract:
A glass core with a cavity-less local interconnect component architecture for complex multi-die packages. The apparatus has the local interconnect component attached directly to a planar glass layer and surrounded by mold. One or more redistribution layers may be located above and below the apparatus.
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