- 专利标题： EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
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申请号： US17896030申请日： 2022-08-25
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公开(公告)号： US20240071990A1公开(公告)日： 2024-02-29
- 发明人: Kelvin Tan Aik Boo , Seng Kim Ye , Hong Wan Ng , Ling Pan , See Hiong Leow
- 申请人： Micron Technology, Inc.
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/48 ; H01L23/498
摘要：
A semiconductor device assembly including a semiconductor device having a plurality of pillars disposed on a backside surface of the semiconductor device; and a substrate, including: a solder mask layer disposed on a front side surface of the substrate, a plurality of extended bond pads disposed on the frontside surface of the substrate and surrounded by the solder mask layer, the plurality of extended bond pads each having a top surface higher than a top surface of the solder mask layer, and wherein the semiconductor device is directly attached to the substrate by bonding each of the plurality of pillars of the semiconductor device to the top surface of a corresponding one of the plurality of extended bond pads with a solder connection.
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