Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE
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Application No.: US18456383Application Date: 2023-08-25
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Publication No.: US20240074151A1Publication Date: 2024-02-29
- Inventor: Takao KOSAKA
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP 22134863 2022.08.26
- Main IPC: H10B12/00
- IPC: H10B12/00

Abstract:
According to one embodiment, a semiconductor device includes a conductive layer, an oxide semiconductor layer provided penetrating the conductive layer in a first direction, and a first insulating film provided between the conductive layer and the oxide semiconductor layer in a second direction that intersects the first direction. The first insulating film comprises boron nitride.
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