Invention Publication
- Patent Title: EMBEDDED TRACE SUBSTRATE ASSEMBLIES, AND RELATED MICROELECTRONIC DEVCE ASSEMBLIES, ELECTRONIC SYSTEMS, AND PROCESSES
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Application No.: US17930021Application Date: 2022-09-06
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Publication No.: US20240079305A1Publication Date: 2024-03-07
- Inventor: Bong Woo Choi , Venkateswarlu Bhavanasi , Naga Raju Sykam
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/00 ; H01L25/065
Abstract:
An embedded trace substrate assembly includes a build-up lamination material with an upper surface on a die side and a board side. A solder-resist material on the die side defines a bond-wire section where bond-finger pads include a first lateral width top first and second plating materials are on the bond-finger pads. The top second plating material has a top surface that above the upper surface of the build-up lamination material. The wire-bond section includes a row of the bond-finger pads, the top first plating material and the top second plating material, and the solder-resist material is set back from a portion of the upper surface and from the bond-finger pads.
Information query
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