- 专利标题: MULTILAYER CAPACITORS WITH INTERDIGITATED FINGERS
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申请号: US18457271申请日: 2023-08-28
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公开(公告)号: US20240079314A1公开(公告)日: 2024-03-07
- 发明人: Hailing Wang , Guillaume Alexandre Blin , David Scott Whitefield , Michael Joseph McPartlin , Lui Ray Lam
- 申请人: Skyworks Solutions, Inc.
- 申请人地址: US CA Irvine
- 专利权人: Skyworks Solutions, Inc.
- 当前专利权人: Skyworks Solutions, Inc.
- 当前专利权人地址: US CA Irvine
- 主分类号: H01L23/522
- IPC分类号: H01L23/522 ; H01G4/30
摘要:
A circuit can include a capacitor that has a semiconductor layer, a dielectric layer, and a conductive layer. The circuit can include an insulating layer and a metal or conductive layer. The metal layer can have a first portion that has a first plurality of fingers, and a second portion that has a second plurality of fingers, which can be interdigitated with the first plurality of fingers. The circuit can include one or more first electrical connections that electrically couple the first portion of the metal layer to the semiconductor layer of the capacitor. The circuit can include one or more second electrical connections that electrically couple the second portion of the metal layer to the conductive layer of the capacitor. A capacitance provided by the interdigitated first and second pluralities of fingers can be at least about 3% of a capacitance provided by the capacitor.
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