A semiconductor package may include a first redistribution structure, a first semiconductor chip on the first redistribution structure, a first molding layer covering the first semiconductor chip, first connection structures on the first redistribution structure and extending in a vertical direction while passing through the first molding layer, a second redistribution structure on the first semiconductor chip, a second semiconductor chip on the second redistribution structure, and a metal layer on the second semiconductor chip. The metal layer may be in contact with an upper surface of the second semiconductor chip.