Invention Publication
- Patent Title: MEMS DEVICE
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Application No.: US18460885Application Date: 2023-09-05
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Publication No.: US20240083741A1Publication Date: 2024-03-14
- Inventor: Daisuke NISHINOHARA , Hideaki HASHIMOTO , Toma FUJITA
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Priority: JP 22143952 2022.09.09
- Main IPC: B81B3/00
- IPC: B81B3/00

Abstract:
The present disclosure provides a MEMS device having a movable portion. The MEMS device includes: a substrate; a recess, disposed in the substrate; the movable portion, hollowly supported in the recess; and a bump stop, hollowly supported in the recess and configured to restrict a movement of the movable portion by contacting the movable portion. The bump stop includes: a protruding portion, configured to contact the movable portion; and a shock absorbing portion, disposed between the protruding portion and the substrate and configured to absorb at least a part of an impact force applied to the protruding portion by elastic deformation.
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