公开(公告)号：US20240083741A1

公开(公告)日：2024-03-14

申请号：US18460885

申请日：2023-09-05

Applicant: ROHM CO., LTD.

Inventor： Daisuke NISHINOHARA ,  Hideaki HASHIMOTO ,  Toma FUJITA

IPC: B81B3/00

CPC classification number: B81B3/0051 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2201/042 ,  B81B2201/052 ,  B81B2203/0118 ,  B81B2203/0346

Abstract: The present disclosure provides a MEMS device having a movable portion. The MEMS device includes: a substrate; a recess, disposed in the substrate; the movable portion, hollowly supported in the recess; and a bump stop, hollowly supported in the recess and configured to restrict a movement of the movable portion by contacting the movable portion. The bump stop includes: a protruding portion, configured to contact the movable portion; and a shock absorbing portion, disposed between the protruding portion and the substrate and configured to absorb at least a part of an impact force applied to the protruding portion by elastic deformation.