发明公开
- 专利标题: Predicting Thermal States In Connected Devices To Provide Edge Processing
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申请号: US17931818申请日: 2022-09-13
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公开(公告)号: US20240087486A1公开(公告)日: 2024-03-14
- 发明人: Parthiban ELLAPPAN , Danlu ZHANG , Peerapol TINNAKORNSRISUPHAP , Jiaying PAN , Xiaoxin ZHANG , Brian MOMEYER
- 申请人: QUALCOMM Incorporated
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM Incorporated
- 当前专利权人: QUALCOMM Incorporated
- 当前专利权人地址: US CA San Diego
- 主分类号: G09G3/00
- IPC分类号: G09G3/00 ; G06F1/16 ; G06F1/20 ; H04L67/125
摘要:
Embodiments include methods for managing component temperatures in wearable devices by a remote computing device, such as an edge server, instructing changes in wearable device component processing loads, operations or operating modes. Methods performed in a wearable device receiving data from an edge server may include obtaining a plurality of temperature measurements from a plurality of hardware components, transmitting the temperature measurements to the edge server, receiving an instruction related to operations of an application executing on the processor of the wearable device, and adjusting an operating parameter based on the received instruction. Methods performed in the edge server include receiving the temperature measurements from the wearable device, identify one or more adjustments to operations of the plurality of hardware components based on the plurality of temperature measurements, and sending the wearable device an instruction to adjust operations of at least one of the plurality of hardware components.
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