Invention Publication
- Patent Title: GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DUAL NANORIBBON CHANNEL STRUCTURES
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Application No.: US18510402Application Date: 2023-11-15
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Publication No.: US20240088253A1Publication Date: 2024-03-14
- Inventor: Tanuj TRIVEDI , Rahul RAMASWAMY , Jeong Dong KIM , Babak FALLAHAZAD , Hsu-Yu CHANG , Ting CHANG , Nidhi NIDHI , Walid M. HAFEZ
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L21/02 ; H01L29/06 ; H01L29/10 ; H01L29/165 ; H01L29/66

Abstract:
Gate-all-around integrated circuit structures having dual nanowire/nanoribbon channel structures, and methods of fabricating gate-all-around integrated circuit structures having dual nanowire/nanoribbon channel structures, are described. For example, an integrated circuit structure includes a first vertical arrangement of nanowires above a substrate. A dielectric cap is over the first vertical arrangement of nanowires. A second vertical arrangement of nanowires is above the substrate. Individual ones of the second vertical arrangement of nanowires are laterally staggered with individual ones of the first vertical arrangement of nanowires and the dielectric cap.
Information query
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