Invention Publication
- Patent Title: SPEAKER MODULE AND EARPHONE
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Application No.: US18272495Application Date: 2022-08-24
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Publication No.: US20240089650A1Publication Date: 2024-03-14
- Inventor: Chuanguo WANG , Yunhai LI , Dong WU , Chienfeng YEH , Yuanwu JIANG
- Applicant: Beijing Honor Device Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: Beijing Honor Device Co., Ltd.
- Current Assignee: Beijing Honor Device Co., Ltd.
- Current Assignee Address: CN Beijing
- Priority: CN 2111276330.X 2021.10.29
- International Application: PCT/CN2022/114634 2022.08.24
- Date entered country: 2023-07-14
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R9/06 ; H04R17/00

Abstract:
Disclosed are a speaker module and an earphone. The speaker module includes a first speaker unit, a bracket, and a second speaker unit. The first speaker unit includes a basin frame and a wiring terminal. The wiring terminal is disposed on the basin frame. The bracket includes an electrically conductive portion. The second speaker unit is fastened to the basin frame by using the bracket. An electrode of the second speaker unit is electrically connected to the wiring terminal by using the electrically conductive portion.
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