公开(公告)号：US20240284111A1

公开(公告)日：2024-08-22

申请号：US18688891

申请日：2022-08-24

Applicant: Beijing Honor Device Co., Ltd.

Inventor： Yunhai LI ,  Jianfei CHU

IPC: H04R9/02 ,  H04R1/10 ,  H04R1/24 ,  H04R7/18 ,  H04R9/04 ,  H04R9/06

CPC classification number: H04R9/025 ,  H04R1/24 ,  H04R7/18 ,  H04R9/045 ,  H04R9/047 ,  H04R9/06 ,  H04R1/10

Abstract: A kernel of a speaker module, a speaker module, and an earphone are provided and related to the field of electronic product technologies. The kernel includes a first diaphragm assembly, a first voice coil, a magnetic circuit system, a second diaphragm assembly, and a second voice coil. The magnetic circuit system includes a first magnetic portion, a second magnetic portion, and a third magnetic portion. The first magnetic portion surrounds a periphery of the second magnetic portion. The first voice coil cooperates with the first magnetic portion and the second magnetic portion to drive the first diaphragm assembly to vibrate. The second voice coil is fastened to the second diaphragm assembly, and the second diaphragm and the first diaphragm assembly are arranged on the magnetic circuit system. The second voice coil cooperates with the second magnetic portion to drive the second diaphragm assembly to vibrate.

公开(公告)号：US20240080610A1

公开(公告)日：2024-03-07

申请号：US18272934

申请日：2022-08-25

Applicant: Beijing Honor Device Co., Ltd.

Inventor： Jinhua LIU ,  Jianfei CHU ,  Yunhai LI ,  Chuanguo WANG

IPC: H04R1/24 ,  H04R1/10 ,  H04R9/06

CPC classification number: H04R1/24 ,  H04R1/1016 ,  H04R1/1075 ,  H04R9/06

Abstract: A speaker module and a headset (100) are provided. The speaker module is used for the headset (100). The headset (100) includes a housing (1). The speaker module includes a first speaker unit (4a) and a second speaker unit (4b). An outer surface of a first diaphragm assembly (4a21) of the first speaker unit (4a) faces a first side, the second speaker unit (4b) is located on one side of a circumferential direction of the first speaker unit (4a), the second speaker unit (4b) emits sound toward the first side, and sound emission frequency of the second speaker unit (4b) is greater than sound emission frequency of the first speaker unit (4a).

公开(公告)号：US20240089650A1

公开(公告)日：2024-03-14

申请号：US18272495

申请日：2022-08-24

Applicant: Beijing Honor Device Co., Ltd.

Inventor： Chuanguo WANG ,  Yunhai LI ,  Dong WU ,  Chienfeng YEH ,  Yuanwu JIANG

IPC: H04R1/10 ,  H04R9/06 ,  H04R17/00

CPC classification number: H04R1/1075 ,  H04R1/1016 ,  H04R1/1041 ,  H04R9/06 ,  H04R17/00 ,  H04R2400/11

Abstract: Disclosed are a speaker module and an earphone. The speaker module includes a first speaker unit, a bracket, and a second speaker unit. The first speaker unit includes a basin frame and a wiring terminal. The wiring terminal is disposed on the basin frame. The bracket includes an electrically conductive portion. The second speaker unit is fastened to the basin frame by using the bracket. An electrode of the second speaker unit is electrically connected to the wiring terminal by using the electrically conductive portion.