Invention Publication
- Patent Title: SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION
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Application No.: US17933187Application Date: 2022-09-19
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Publication No.: US20240096750A1Publication Date: 2024-03-21
- Inventor: Qingqing LIANG , Periannan CHIDAMBARAM , George Pete IMTHURN , Stanley Seungchul SONG
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/762 ; H01L21/768 ; H01L23/528 ; H01L27/12 ; H01L29/417
Abstract:
Disclosed are integrated circuit structures with through-substrate vias (TSVs) processed through self-aligned contact modules. As a result, much smaller and/or denser TSVs are formed with low mechanical stress. The denser TSVs allow for more flexible wiring options.
Information query
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