Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE
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Application No.: US18456419Application Date: 2023-08-25
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Publication No.: US20240097044A1Publication Date: 2024-03-21
- Inventor: Yusuke KASAHARA , Kappei IMAMURA , Akifumi GAWASE , Shinji MORI , Akihiro KAJITA
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP 22148833 2022.09.20
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/417 ; H10B12/00

Abstract:
According to one embodiment, a semiconductor device includes a first conductive layer between first and second insulating layers with an oxide semiconductor column extending in the first direction through these layers. A third insulating layer covers the column. The column has a first semiconductor portion at a first position matching the first insulating layer, a second semiconductor portion at a second position matching second insulating layer, and a third semiconductor portion at a third position matching the first conductive layer. The first semiconductor portion is continuous along a second direction between the third insulating layer, the second semiconductor portion is continuous along the second direction between the third insulating layer, but the third semiconductor portion is not continuous between the third insulating layer.
Information query
IPC分类: