Invention Publication
- Patent Title: LEAKY CABLE AND METHOD OF MANUFACTURING LEAKY CABLE
-
Application No.: US18238227Application Date: 2023-08-25
-
Publication No.: US20240097343A1Publication Date: 2024-03-21
- Inventor: Hideyuki SAGAWA , Takahiro SUGIYAMA , Izumi FUKASAKU , Yasunori TAKAKI , Nobuaki KITANO , Shuichi NUMATA
- Applicant: Proterial, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Proterial, Ltd.
- Current Assignee: Proterial, Ltd.
- Current Assignee Address: JP Tokyo
- Priority: JP 22149547 2022.09.20
- Main IPC: H01Q13/20
- IPC: H01Q13/20 ; H01P3/06 ; H01P3/127 ; H01P11/00

Abstract:
A leaky cable is provided with a linear insulator and a metal layer formed on an outer peripheral surface of the insulator. A slot for leaking electromagnetic waves is formed through the metal layer between an inner peripheral surface and an outer peripheral surface of the metal layer, and the outer peripheral surface of the insulator is formed with unevenness that inhibits misalignment of the slot with respect to the insulator. The method of manufacturing the leaky cable includes forming an insulator composed of thermoplastic resin in a cylindrical shape, roughening an outer peripheral surface of the insulator, forming a metal layer on the outer peripheral surface of the insulator, and forming a slot through the metal layer between an inner peripheral surface and an outer peripheral surface of the metal layer. The slot is configured to leak electromagnetic waves to outside of the metal layer.
Information query