Invention Publication
- Patent Title: ENCLOSURE ASSEMBLIES, AND RELATED DEVICES AND METHODS
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Application No.: US18265049Application Date: 2021-12-03
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Publication No.: US20240107654A1Publication Date: 2024-03-28
- Inventor: Vineet K. Pandey , William B. Fields , Isreal I. Llaguno , Bharadwaj Ramakrishnan , Bradford K.O. Palmer , Jaydeep V. Patel , Michael Hays , Dakshina S. Murthy-Bellur , Amir Tajuddin Tamboli , Rohit Saha
- Applicant: Cummins Inc.
- Applicant Address: US IN Columbus
- Assignee: Cummins Inc.
- Current Assignee: Cummins Inc.
- Current Assignee Address: US IN Columbus
- International Application: PCT/US2021/061887 2021.12.03
- Date entered country: 2023-06-02
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/14
Abstract:
A cooling plate assembly for dual-sided cooling, the cooling plate assembly can include a first cooling plate and a second cooling plate. The first cooling plate that has a first cooling plate connector side and a first cooling plate cooling side that is opposite the first cooling plate connector side. The second cooling plate that has a second cooling plate connector side and a second cooling plate cooling side that is opposite the second cooling plate connector side. The second cooling plate is configured to attach to the first cooling plate such that formed between the first cooling plate connector side and the second cooling plate connector side is at least one cooling passage through which a cooling fluid is flowed to transfer heat from both the first cooling plate cooling side and the second cooling plate cooling side to the cooling fluid.
Information query
