A system for laminating an adhesive to a component includes a liner including a first major surface facing the component and a second major surface opposite to the first major surface. An adhesive is disposed on the first major surface. The adhesive is configured to be laminated to the component. A support pad engages the second major surface of the liner for laminating the adhesive to the component. Each of the support pad and the liner undergoes deformation upon engagement of the support pad with the liner. The support pad includes a body made of an elastic pad material and includes an upper surface facing the component, a lower surface opposite to the upper surface, and a lateral surface disposed between the upper surface and the lower surface. The liner includes a conformable liner material having a liner elastic modulus from about 5 megapascals (MPa) to about 650 MPa.