Invention Publication
- Patent Title: FLUID CONDUIT AND FLANGE FOR HIGH BIAS APPLICATIONS
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Application No.: US18371641Application Date: 2023-09-22
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Publication No.: US20240112894A1Publication Date: 2024-04-04
- Inventor: Sankaranarayanan RAVI , Alvaro GARCIA , Martin Perez GUZMAN , Stephen D. PROUTY , Andreas SCHMID
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/683
Abstract:
A method and apparatus for cooling a semiconductor chamber are described herein. A semiconductor chamber component, includes a powered region, a grounded region, and a fluid conduit disposed within the semiconductor chamber component and passing through the powered region and grounded region, the fluid conduit comprising a ceramic material.
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