公开(公告)号：US20240112894A1

公开(公告)日：2024-04-04

申请号：US18371641

申请日：2023-09-22

Applicant: Applied Materials, Inc.

Inventor： Sankaranarayanan RAVI ,  Alvaro GARCIA ,  Martin Perez GUZMAN ,  Stephen D. PROUTY ,  Andreas SCHMID

IPC: H01J37/32 ,  H01L21/683

CPC classification number: H01J37/32724 ,  H01L21/6833 ,  H01J2237/002 ,  H01J2237/2007

Abstract: A method and apparatus for cooling a semiconductor chamber are described herein. A semiconductor chamber component, includes a powered region, a grounded region, and a fluid conduit disposed within the semiconductor chamber component and passing through the powered region and grounded region, the fluid conduit comprising a ceramic material.

公开(公告)号：US20240110836A1

公开(公告)日：2024-04-04

申请号：US18368052

申请日：2023-09-14

Applicant: Applied Materials, Inc.

Inventor： Sankaranarayanan RAVI ,  Alvaro GARCIA ,  Martin Perez GUZMAN ,  Stephen Donald PROUTY ,  Andrew Antoine NOUJAIM

IPC: G01K11/00 ,  H01J37/32

CPC classification number: G01K11/00 ,  H01J37/32715 ,  H01J2237/2007 ,  H01J2237/24585 ,  H01J2237/334

Abstract: The disclosure relates to a substrate support assembly and apparatus for measuring the temperature of a substrate disposed on the support assembly. In one embodiment, a substrate temperature measurement apparatus includes a substrate support assembly, a probe assembly, and a probe target. The substrate support assembly includes an electrostatic chuck and one or more plates. The probe assembly within the substrate support assembly extends through one or more of the one or more plates. The probe assembly includes an optical probe sensor, an optical fiber coupled to the optical probe sensor, and an insulating sheath surrounding the optical fiber. The probe target includes a phosphor coating, is in contact with the electrostatic chuck, and is spaced from the probe assembly.