A semiconductor device configured by bonding a first and a second chip together, including: a first signal output circuit provided at both the first and the second chip and driven by a first drive power; a second signal output circuit provided at both the first and the second chip and driven by a second drive power; a first phase comparison circuit, provided at the first chip, that compares a phase of a first signal and a second signal; a second phase comparison circuit that is provided at the second chip, and that compares a phase of a third signal and a fourth signal; a third phase comparison circuit, provided at the first chip, that compares a phase of a fifth signal and a sixth signal; and a fourth phase comparison circuit, provided at the second chip, that compares a phase of a seventh signal and an eighth signal.