发明公开
- 专利标题: HOT-STAMPING FORMED BODY
-
申请号: US18273472申请日: 2022-02-10
-
公开(公告)号: US20240117477A1公开(公告)日: 2024-04-11
- 发明人: Kodai MURASAWA , Shingo FUJINAKA , Yuri TODA
- 申请人: NIPPON STEEL CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: NIPPON STEEL CORPORATION
- 当前专利权人: NIPPON STEEL CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP 21019911 2021.02.10
- 国际申请: PCT/JP2022/005360 2022.02.10
- 进入国家日期: 2023-07-20
- 主分类号: C22C38/32
- IPC分类号: C22C38/32 ; B32B15/01 ; C21D1/18 ; C21D6/00 ; C21D8/02 ; C21D9/46 ; C22C38/00 ; C22C38/02 ; C22C38/04 ; C22C38/06 ; C22C38/08 ; C22C38/10 ; C22C38/12 ; C22C38/14 ; C22C38/16 ; C22C38/28
摘要:
This hot-stamping formed body includes, as a chemical composition, by mass %: C: 0.15% or more and 0.50% or less; Si: 0.10% or more and 3.00% or less; Mn: 0.10% or more and 3.00% or less; P: less than 0.10%; S: less than 0.10%; N: less than 0.10%; Ti: 0.020% or more and 0.150% or less; B: 0.002% or more and 0.010% or less; optionally Al, Cr, Mo, Co, Ni, Cu, V, W, Ca, Mg, and REM; and a remainder including Fe and impurities, in which a microstructure of the hot-stamping formed body includes, by volume fraction, 85% or more of martensite and less than 15% of retained austenite, and in the microstructure, a standard deviation of a frequency distribution of nanohardnesses is 0.70 GPa or less, and an average grain size is 4.0 μm or less.
信息查询