Invention Publication
- Patent Title: MULTILAYER COIL COMPONENT
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Application No.: US18335607Application Date: 2023-06-15
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Publication No.: US20240120140A1Publication Date: 2024-04-11
- Inventor: Noriaki HAMACHI , Toshinori MATSUURA , Junichiro URABE , Kota OIKAWA , Yuto SHIGA , Youichi KAZUTA , Yuichi TAKUBO , Shunya SUZUKI , Xuran GUO , So KOBAYASHI
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP 22163307 2022.10.11
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F27/29

Abstract:
A plurality of through-hole conductors include a first through-hole conductor and a second through-hole conductor between coil conductors adjacent each other. Each of the first through-hole conductor and the second through-hole conductor includes a first end and a second end. The first end included in the second through-hole conductor is coupled to the second end included in the first through-hole conductor, and has a width larger than a width of the second end included in the first through-hole conductor. The first end included in the first through-hole conductor has a width larger than the width of the second end included in the first through-hole conductor. The second end included in the second through-hole conductor has a width smaller than the width of the first end included in the second through-hole conductor.
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |