Invention Publication
- Patent Title: COIL SUBSTRATE
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Application No.: US18273101Application Date: 2022-01-19
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Publication No.: US20240120141A1Publication Date: 2024-04-11
- Inventor: Byeong Geuk KANG , Younseok JANG
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Priority: KR 20210008192 2021.01.20
- International Application: PCT/KR2022/000989 2022.01.19
- Date entered country: 2023-07-19
- Main IPC: H01F27/00
- IPC: H01F27/00 ; H01F5/00

Abstract:
The present specification relates to a coil substrate. A coil substrate according to one embodiment of the present specification comprises: a substrate; and a coil which is mounted on one surface of the substrate and comprises a plurality of turns, wherein the plurality of turns comprise a first inner turn located at the innermost side of the coil and a first outer turn located at the outermost side of the coil, wherein the first inner turn comprises a greater number of patterns than the first outer turn.
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F27/00 | 变压器或电感器的一般零部件 |