公开(公告)号：US20240120141A1

公开(公告)日：2024-04-11

申请号：US18273101

申请日：2022-01-19

Applicant: LG ELECTRONICS INC.

Inventor： Byeong Geuk KANG ,  Younseok JANG

IPC: H01F27/00 ,  H01F5/00

CPC classification number: H01F27/006 ,  H01F5/003

Abstract: The present specification relates to a coil substrate. A coil substrate according to one embodiment of the present specification comprises: a substrate; and a coil which is mounted on one surface of the substrate and comprises a plurality of turns, wherein the plurality of turns comprise a first inner turn located at the innermost side of the coil and a first outer turn located at the outermost side of the coil, wherein the first inner turn comprises a greater number of patterns than the first outer turn.

公开(公告)号：US20180376543A1

公开(公告)日：2018-12-27

申请号：US16018178

申请日：2018-06-26

Applicant: LG ELECTRONICS INC.

Inventor： Byeong Geuk KANG ,  Ho Yong JANG ,  Jea Shik HEO

IPC: H05B6/06 ,  H05B6/12

Abstract: The present disclosure relates to an induction heating device. A loaded-object sensor according to the present disclosure is arranged concentrically and centrally in the working coil. Thus, the sensing coil and the working coil are adjacent to each other. When a current for the heating operation is applied to the working coil, an induction voltage is generated in the sensing coil by magnetic force generated by the current applied to the working coil. According to the present disclosure, a resistor circuit is used to reduce the induction voltage generated in the sensing coil when the heating operation of the working coil is performed.