MANUFACTURING METHOD OF PHOTOELECTRIC CONVERSION PANEL, MANUFACTURING METHOD OF X-RAY IMAGING PANEL, AND PHOTOELECTRIC CONVERSION PANEL
Abstract:
Provided is a manufacturing method of a photoelectric conversion panel including forming a photodiode in a frame region, forming a first wiring line overlapping a first portion in a plan view, the first wiring line connecting a TFT or a photodiode and the photodiode, forming a second wiring line not overlapping the first portion in a plan view and overlapping a second portion in the plan view, and forming a third portion between the first portion and the second portion. The third portion is a portion not overlapping the first wiring line and the second wiring line in a plan view. Thereafter, the manufacturing method of a photoelectric conversion panel includes dividing the photodiode and the substrate at the third portion.
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