公开(公告)号：US20240350013A1

公开(公告)日：2024-10-24

申请号：US18589741

申请日：2024-02-28

Applicant: Sharp Display Technology Corporation

Inventor： Takeshi HARA ,  Hisao UEMOTO ,  Mitsuru CHIDA ,  Midori KAGEYAMA ,  Rikiya TAKITA ,  Yang QU

IPC: A61B5/00

CPC classification number: A61B5/0059 ,  A61B2562/0238 ,  A61B2562/164

Abstract: Provided is a wearable sensor with enhanced light sensitivity. The wearable sensor is to be worn by a subject, the wearable sensor including: a supporting substrate; and sensor elements placed on the supporting substrate. The sensor elements each include: a light emitter which is an organic light emitting diode or an inorganic light emitting diode; and a reflected light receiver configured to measure a quantity of light emitted from the light emitter and reflected in a living body of a subject. Preferably, in a plan view, at least part of the reflected light receiver does not overlap the light emitter.

公开(公告)号：US20240128298A1

公开(公告)日：2024-04-18

申请号：US18237153

申请日：2023-08-23

Applicant: Sharp Display Technology Corporation

Inventor： Rikiya TAKITA

IPC: H01L27/146 ,  G01T1/20

CPC classification number: H01L27/14636 ,  G01T1/2018 ,  H01L27/14663 ,  H01L27/14689

Abstract: Provided is a manufacturing method of a photoelectric conversion panel including forming a photodiode in a frame region, forming a first wiring line overlapping a first portion in a plan view, the first wiring line connecting a TFT or a photodiode and the photodiode, forming a second wiring line not overlapping the first portion in a plan view and overlapping a second portion in the plan view, and forming a third portion between the first portion and the second portion. The third portion is a portion not overlapping the first wiring line and the second wiring line in a plan view. Thereafter, the manufacturing method of a photoelectric conversion panel includes dividing the photodiode and the substrate at the third portion.

公开(公告)号：US20250022907A1

公开(公告)日：2025-01-16

申请号：US18736459

申请日：2024-06-06

Applicant: Sharp Display Technology Corporation

Inventor： Rikiya TAKITA ,  Fumiki Nakano ,  Makoto Nakazawa ,  Hiroyuki Moriwaki

IPC: H01L27/146

Abstract: A manufacturing method of a photoelectric conversion panel includes forming a short ring, forming a plurality of data lines connected to a TFT and the short ring, forming a first conductive portion of a bias line connected to the photodiode in an upper layer above the photodiode, electrically blocking the short ring and the TFT from each other by cutting the plurality of data lines after the forming of the first conductive portion, and forming an inorganic insulating film in a blocking portion created by the plurality of data lines being cut.

公开(公告)号：US20230030238A1

公开(公告)日：2023-02-02

申请号：US17391747

申请日：2021-08-02

Applicant: Sharp Display Technology Corporation

Inventor： Hiroyuki MORIWAKI ,  Makoto NAKAZAWA ,  Tetsuya TANISHIMA ,  Rikiya TAKITA

IPC: H01L27/146

Abstract: A photoelectric conversion panel includes: a thin film transistor; a first organic film formed in an upper layer with respect to the thin film transistor; a photoelectric conversion element formed in an upper layer with respect to the first organic film; and a first inorganic insulating film formed so as to cover at least a part of the first organic film, wherein the first inorganic insulating film has a through hole that exposes a part of the first organic film.

公开(公告)号：US20220390624A1

公开(公告)日：2022-12-08

申请号：US17827087

申请日：2022-05-27

Applicant: Sharp Display Technology Corporation

Inventor： Rikiya TAKITA ,  Fumiki NAKANO ,  Makoto NAKAZAWA ,  Hiroyuki MORIWAKI

IPC: G01T1/20 ,  H01L27/146

Abstract: A photoelectric conversion panel includes multiple thin-film transistors (TFTs) formed on an substrate, photodiodes respectively connected to the TFTs, and a metal layer formed on a light incident side of the photodiodes. The metal layer is formed in a position to overlap a subset of the photodiodes in a plan view.

公开(公告)号：US20230387177A1

公开(公告)日：2023-11-30

申请号：US18197117

申请日：2023-05-15

Applicant: Sharp Display Technology Corporation

Inventor： Makoto NAKAZAWA ,  Hiroyuki MORIWAKI ,  Rikiya TAKITA ,  Tetsuya TANISHIMA

IPC: H01L27/146 ,  G01T1/20

CPC classification number: H01L27/14689 ,  H01L27/14663 ,  H01L27/14636 ,  G01T1/2018

Abstract: In a manufacturing method of a photoelectric conversion panel, a contact hole CH3 that exposes a part of an upper face of a photodiode and a contact hole CH2 that exposes a source connection electrode are formed in a first flattening film and in inorganic insulating films 105a to 105c, an inorganic insulating film 107 is formed, contact holes CH2a and CH3a are formed in the contact holes CH2 and CH3, respectively, and a bias line and a data line are formed in the contact holes CH2a and CH3a, respectively.

公开(公告)号：US20220367544A1

公开(公告)日：2022-11-17

申请号：US17717613

申请日：2022-04-11

Applicant: Sharp Display Technology Corporation

Inventor： Rikiya TAKITA ,  Fumiki NAKANO

IPC: H01L27/146

Abstract: A photoelectric conversion panel includes: a substrate; a gate line and a data line formed on the substrate; a pixel transistor connected to the gate line and the data line; a photoelectric conversion element connected to the pixel transistor; an electro-static-discharge protection circuit formed on the substrate and connected to a ground; a depletion transistor for protection connected between either the gate line or the data line and the electro-static-discharge protection circuit; and an interrupting voltage supply line configured to apply an interrupting voltage to a gate electrode of the depletion transistor for protection.

公开(公告)号：US20220342092A1

公开(公告)日：2022-10-27

申请号：US17718711

申请日：2022-04-12

Applicant: Sharp Display Technology Corporation

Inventor： Makoto NAKAZAWA ,  Rikiya TAKITA ,  Fumiki NAKANO

IPC: G01T1/24

Abstract: According to an aspect, an active matrix substrate of an X-ray imaging panel includes: an active matrix substrate having a pixel region including a plurality of pixels; and a scintillator that converts X-rays projected onto the X-ray imaging panel to scintillation light. The plurality of pixels include respective photoelectric conversion elements. The active matrix substrate further includes a first planarizing film that covers the photoelectric conversion elements, is formed from an organic resin film, and has a plurality of first contact holes and a first wiring line that is formed in the first contact holes and in a layer upper than the first planarizing film and connected to the photoelectric conversion elements within the first contact holes.