Invention Publication
- Patent Title: METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
-
Application No.: US18452829Application Date: 2023-08-20
-
Publication No.: US20240136302A1Publication Date: 2024-04-25
- Inventor: Ryusei TAKAISHI
- Applicant: RENESAS ELECTRONICS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP 22170856 2022.10.24
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L23/00 ; H01L23/31 ; H01L23/495 ; H01L25/065 ; H01L25/16
Abstract:
A bonding region is specified by having a horizontal line partially constituting crosshairs displayed on a monitor of a wire bonding apparatus superimposed on a first line segment of a first marker, and having a vertical line partially constituting the crosshairs superimposed on a first line segment of a second marker.
Public/Granted literature
- US20240234331A9 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2024-07-11
Information query
IPC分类:
