发明公开
- 专利标题: SEMICONDUCTOR PACKAGE
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申请号: US18400497申请日: 2023-12-29
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公开(公告)号: US20240136329A1公开(公告)日: 2024-04-25
- 发明人: Hyuekjae Lee , Dae-Woo Kim , Eunseok Song
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR 20200142013 2020.10.28
- 主分类号: H01L25/065
- IPC分类号: H01L25/065 ; H01L23/00 ; H01L25/10 ; H01L25/18
摘要:
A semiconductor package includes a first semiconductor chip including a first wiring layer including a first wiring structure and providing a first rear surface, and a first through via for first through via for power electrically connected to the first wiring structure; and a second semiconductor chip including a second wiring layer including a second wiring structure and providing a second rear surface, and a second through via for second through via for power electrically connected to the second wiring structure, wherein the first and second semiconductor chips have different widths, wherein the first semiconductor chip receives power through the first wiring structure and the first through via for first through via for power, wherein the second semiconductor chip receives power through the second wiring structure and the second through via for second through via for power.
公开/授权文献
- US20240234374A9 SEMICONDUCTOR PACKAGE 公开/授权日:2024-07-11
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