Invention Publication
- Patent Title: RESIN MEMBRANE FILTER AND MANUFACTURING METHOD OF RESIN MEMBRANE FILTER
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Application No.: US18395615Application Date: 2023-12-24
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Publication No.: US20240139686A1Publication Date: 2024-05-02
- Inventor: Hiroyuki YONEZAWA
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP 21119362 2021.07.20
- Main IPC: B01D67/00
- IPC: B01D67/00 ; B01D69/02 ; B01L3/00 ; G03F7/00 ; G03F7/038 ; G03F7/039 ; G03F7/40

Abstract:
An object of the present invention is to provide a resin membrane filter having excellent separation accuracy and excellent toughness, and a manufacturing method of the resin membrane filter.
The resin membrane filter of the present invention includes a first main surface, a second main surface, and a plurality of through-holes, in which, in the through-hole, in a case where an average area of an opening portion at a position A which is located at a distance of 10% of a thickness of the resin membrane filter from the first main surface is denoted as Sva and an average area of an opening portion at a position B which is located at a distance of 90% of the thickness of the resin membrane filter from the first main surface is denoted as Svb, 0.8≤Sva/Svb≤1.25, a number ratio Ra of through-holes in which an area of the opening portion at the position A is more than 1.25 times Sva is 3.0% or less, and a number ratio Rb of through-holes in which an area of the opening portion at the position B is more than 1.25 times Svb is 3.0% or less.
The resin membrane filter of the present invention includes a first main surface, a second main surface, and a plurality of through-holes, in which, in the through-hole, in a case where an average area of an opening portion at a position A which is located at a distance of 10% of a thickness of the resin membrane filter from the first main surface is denoted as Sva and an average area of an opening portion at a position B which is located at a distance of 90% of the thickness of the resin membrane filter from the first main surface is denoted as Svb, 0.8≤Sva/Svb≤1.25, a number ratio Ra of through-holes in which an area of the opening portion at the position A is more than 1.25 times Sva is 3.0% or less, and a number ratio Rb of through-holes in which an area of the opening portion at the position B is more than 1.25 times Svb is 3.0% or less.
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