Invention Publication
- Patent Title: METHOD OF ATTACHING FILM
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Application No.: US17974481Application Date: 2022-10-26
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Publication No.: US20240140785A1Publication Date: 2024-05-02
- Inventor: Chin-Song LEE
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: B81C1/00
- IPC: B81C1/00
Abstract:
A method of attaching a film is provided. The method includes providing a carrier tape. The carrier tape supports a film over a surface of the carrier tape. The method further includes moving the film to a position over an electronic device. The method further includes attaching the film to the electronic device.
Information query
