公开(公告)号：US20210130163A1

公开(公告)日：2021-05-06

申请号：US16670790

申请日：2019-10-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yueh-Ju LIN ,  Chih-Cheng HUNG ,  Chin-Song LEE ,  Yun-Chih FEI

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor device package includes a redistribution layer structure, a semiconductor component, an encapsulant and a sensing component. The semiconductor component is disposed on a top surface of the RDL structure. The encapsulant covers the semiconductor component, the RDL structure, and an electrical connection member. The sensing component is disposed on a top surface of the encapsulant. The electrical connection member is in contact with a pad of the semiconductor component and has a first surface exposed from the top surface of the encapsulant, and the semiconductor component package includes a wire connecting the sensing component and the first surface of the electrical connection member.

公开(公告)号：US20240140785A1

公开(公告)日：2024-05-02

申请号：US17974481

申请日：2022-10-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chin-Song LEE

IPC: B81C1/00

CPC classification number: B81C1/00285

Abstract: A method of attaching a film is provided. The method includes providing a carrier tape. The carrier tape supports a film over a surface of the carrier tape. The method further includes moving the film to a position over an electronic device. The method further includes attaching the film to the electronic device.