A deposition apparatus includes a chamber providing an inner space and a deposition source including an accommodation module accommodating a deposition material and a heater module providing heat to the deposition material. The deposition source is accommodated in the inner space to provide the deposition material. The heater module includes a first heater cover including a surface facing the accommodation module, including an insulating material, and provided with a first through hole, a second heater cover including an insulating material and provided with a second through hole, a heater disposed between the first and second heater covers, a fixing frame coupled with the second heater cover to fix the second heater cover and provided with a fastening hole, a coupling member inserted into the first and second through holes and the fastening hole, and a shielding cover covering an end of the coupling member and including an insulating material.