Invention Publication
- Patent Title: Method for manufacturing electronic device
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Application No.: US18403549Application Date: 2024-01-03
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Publication No.: US20240142671A1Publication Date: 2024-05-02
- Inventor: Chi-Fang WU , Chin-Lung TING , I-Chang LIANG
- Applicant: InnoLux Corporation
- Applicant Address: TW Miao-Li County
- Assignee: InnoLux Corporation
- Current Assignee: InnoLux Corporation
- Current Assignee Address: TW Miao-Li County
- The original application number of the division: US16142956 2018.09.26
- Main IPC: G02B1/14
- IPC: G02B1/14 ; G02B5/30
Abstract:
An electronic device includes: a first substrate; a second substrate, disposed opposite to the first substrate; an insulating layer, disposed on a surface of the first substrate away from the second substrate; and a metal layer, disposed on a surface of the second substrate away from the first substrate, wherein a width of the insulating layer is different from a width of the metal layer.
Information query
