Method for manufacturing electronic device
    1.
    发明申请

    公开(公告)号:US20200096673A1

    公开(公告)日:2020-03-26

    申请号:US16142956

    申请日:2018-09-26

    Abstract: A method for manufacturing an electronic device is disclosed, which includes the following steps: assembling a first mother substrate and a second mother substrate; disposing a first protection element on a surface of the first mother substrate away from the second mother substrate; disposing a first mother polarizer on the first protection element; and processing an assembly of the first mother substrate, the second mother substrate, the first protection element, and the first mother polarizer into a plurality of panels.

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