Invention Publication
- Patent Title: NON-CHEMICALLY AMPLIFIED RESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME
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Application No.: US18381678Application Date: 2023-10-19
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Publication No.: US20240142874A1Publication Date: 2024-05-02
- Inventor: Chawon KOH , Jiyoung PARK , Seungyeol BAEK , Tsunehiro NISHI , Jinkyu HAN
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20220143023 2022.10.31
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/004
Abstract:
A non-chemically amplified resist composition includes a photo-decomposable organic resin including a C—O bond in a main chain thereof; an acidic chain scission enhancer; and a solvent.
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