There is provided a manufacturing method of an electronic device, the method comprising: a step of preparing an electronic substrate; a step of forming an insulating layer; and a step of forming a conductive layer, in which the step of forming the insulating layer comprises a first step of applying an ink for forming a first insulating layer to a region where the electronic component is not disposed and irradiating the ink for forming a first insulating layer with a first active energy ray and a second step of applying an ink for forming a second insulating layer to a region which includes a region on an insulating layer formed in the first step and a region where the electronic component is disposed, and irradiating the ink for forming a second insulating layer with a second active energy ray.