A semiconductor device includes a substrate, a chip region in the substrate, a scribe lane region in the substrate, first active patterns in the chip region, a first device isolation pattern on the first active patterns, second active patterns in the scribe lane region, and a second device isolation pattern on the second active patterns. The scribe lane region is adjacent to the chip region. The first device isolation pattern includes a first device isolation material, and the second device isolation pattern includes a second device isolation material. The second device isolation material is different from the first device isolation material.