An electronic device is provided. The electronic device includes a first insulating layer, a second insulating layer, an adhesive layer, and a functional layer. The first insulating layer has a side surface and at least one recess adjacent to the side surface. The second insulating layer is disposed on the first insulating layer and filled in the at least one recess. The adhesive layer is disposed on the second insulating layer. The functional layer is disposed on the adhesive layer. In addition, in a cross-sectional view of the electronic device, the second insulating layer has a thickness at a first position, and a thickness of the adhesive layer corresponding to the first position is greater than the thickness of the second insulating layer.