Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly may include a printed circuit board (PCB) having a first side and a second side, an enclosure that encloses the PCB and includes one or more injection holes, and microbead foam. The first side and/or the second side of PCB may include a plurality of components. The one or more injection holes may be configured for injecting the microbead foam into a gap between the enclosure and one or more components of the plurality of components. At least a portion of the microbead foam may be located in the gap between the enclosure and the one or more components.