A method of cooling an abatement apparatus for abatement of an effluent stream from a semiconductor processing tool includes: providing at least one modular cooling assembly having a cooling capacity; determining a cooling requirement of an abatement apparatus; and incorporating into the abatement apparatus a number of the modular cooling assemblies whose cumulative cooling capacity at least matches the cooling requirement of the abatement apparatus. In this way, multiple modular cooling assemblies may be incorporated into the abatement apparatus, each of which provides cooling capacity. The number of modular cooling assemblies can be selected to suit the cooling requirement of the abatement apparatus.